XCS30XL-4TQG144C

Product Summary

XCS30XL-4TQG144C FPGA is implemented with a regular, flexible, programmable architecture of Configurable Logic Blocks (CLBs), interconnected by a powerful hierarchy of versatile routing resources (routing channels), and surrounded by a perimeter of programmable Input/Output Blocks (IOBs), as seen in the Figure. It has generous routing resources to accommodate the most complex interconnect patterns. The XCS30XL-4TQG144C is customized by loading configuration data into internal static memory cells. Re-programming is possible an unlimited number of times. The values stored in these memory cells determine the logic functions and interconnections implemented in the FPGA. The XCS30XL-4TQG144C can either actively read its configuration data from an external serial PROM (Master Serial mode), or the configuration data can be written into the FPGA from an external device (Slave Serial mode). Spartan series FPGAs can be used where hardware must be adapted to different user applications. FPGAs are ideal for shortening design and development cycles, and also offer a cost-effective solution for production rates well beyond 50,000 systems per month.

Parametrics

XCS30XL-4TQG144C absolute maximum ratings: (1)VCC Supply voltage relative to GND: –0.5 to +7.0 V; (2)VIN Input voltage relative to GND: –0.5 to VCC +0.5 V; (3)VTS Voltage applied to 3-state output: –0.5 to VCC +0.5 V; (4)TSTG Storage temperature (ambient): –65 to +150 ℃; (5)TJ Junction temperature Plastic packages: +125 ℃.

Features

XCS30XL-4TQG144C features: (1)First ASIC replacement FPGA for high-volume production with on-chip RAM; (2)Density up to 1862 logic cells or 40,000 system gates; (3)Streamlined feature set based on XC4000 architecture; (4)System performance beyond 80 MHz; (5)Broad set of AllianceCORE and LogiCORE predefined solutions available; (6)Unlimited reprogrammability; (7)Low cost; (8)Available in both 5V and 3.3V versions; (9)On-chip SelectRAM memory; (10)Fully PCI compliant; (11)Full readback capability for program verification and internal node observability; (12)Dedicated high-speed carry logic; (13)Internal 3-state bus capability; (14)Eight global low-skew clock or signal networks; (15)IEEE 1149.1-compatible Boundary Scan logic; (16)Low cost plastic packages available in all densities; (17)Footprint compatibility in common packages; (18)Fully supported by powerful Xilinx development system; (19)Foundation Series: Integrated, shrink-wrap software; (20)Alliance Series: Dozens of PC and workstation third party development systems supported; (21)Fully automatic mapping, placement and routing.

Diagrams